An Introduction to Mixed-Signal Test and Measurement by Gordon Roberts, Friedrich Taenzler, Mark Burns

By Gordon Roberts, Friedrich Taenzler, Mark Burns

Built-in circuits incorporating either electronic and analog services became more and more regular within the semiconductor undefined. Mixed-signal IC try and dimension has grown right into a hugely really expert box of electric engineering. in spite of the fact that, attempt engineering continues to be a comparatively unknown career in comparison to IC layout engineering.

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Extra resources for An Introduction to Mixed-Signal Test and Measurement

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Monotonic Over the Entire AID Conversion OUT1 1 16 . Range Segmented High-Order Bits Ensure OUT2 GND 2 3 15 REF 14 ~ DB7 4 to Microprocessors D OR N PACKAGE (TOP VIEW) . Low-Glitch Output . Interchangeable With Analog Devices AD7524 PMI PM-7524 and Micro Power System~ MP7524 ' DB6 s DBS 6 DB4 7 . Fast Control Signaling lor Digital DB3 Signal-Processor . ullon Linearity error Powerdissipa1lonatVoo'SV Selting"me , Propaga"on delay "me 8 BIts 1/2 LSB Max SmWMax 100nsMax 3 2 GND DB7 80 ns Max NC description :.

The ATE tester then executes a series of electrical tests on the die before instructing the proberto move to the next die. , and closeup views of a probe card and its probe tips. 14. Electroglaswaferproberand probecard. 3 Handlers Handlersare usedto manipulate packageddevices in much the sameway that probers are used to manipulatewafers. Handlers fall into two categories: gravity-fed and robotic. Robotic handlers are also known as pick-and-place handlers. Gravity-fed handlers are normally used with dual inline packages,while robotic handlers are used with devices having pins on all four sides or pins on the underside (ball grid array packages,for example).

The wafers are then sawed into individual dies and the good ones are attached to lead frames. Lead frames are punched metal holders that eventually become the individual leads of the packaged device. Bond wires are attached from each die's bond pads to the appropriate lead of the lead frame. Then plastic is injection-molded around the dies and lead frame to fonn packaged devices. Finally, the individual packaged devices are separatedfrom one another by trimming them from the lead frame. After the leadshavebeentrimmed and formed,the devicesare ready for final testingon a secondATE tester.

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