Engineering Transportation

Design Guidelines for Surface Mount Technology by John E. Traister

By John E. Traister

Contents: part choice; house making plans and Interface; Specifying fabric for Substrates; The SMT meeting procedure; touch Geometry for SMT elements; layout instructions; paintings new release. Appendixes. This ebook is a realistic, engineering-level advisor to designing with floor mounting know-how and the producing procedures concerned.

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The general trend of thermal resistance decreasing with increasing power is common to all packages. Figure 2-36 shows the average effect of power dissipation of SMD 0 J A.

6 6 0 . 710 . 3 20 . 500 χ . 7 6 0 . 510 X X X X PCC-18A . 350 χ . 550 PCC-18B . 350 χ . 5 7 0 . 400 χ . 6 2 0 . 248 PCC-20 . 4 25 χ . 4 2 5 . 475 . 226 PCC-28 . 5 25 χ . 5 2 5 . 276 . 331 PCC-44 . 725 χ . 775 . 601 PCC-52 . 8 25 χ . 051 1. 0 7 5 χ X . 075 1. 1 5 6 X DIP-8 . 360 χ . 4 0 0 . 460 χ . 5 0 0 . 230 D1P-14 . 360 χ . 360 χ . 7 8 5 . 885 DIP-24 . 6 6 0 χ 1. 2 5 0 . 8 25 . 540 1. 1 7 0 DIP-40 . 660 χ 2. 379 . 7 6 0 χ 2. 664 Fig. 2-27: A space analysis sheet will facilitate planning areas for assembly.

2-17: Specifications of typical PCC devices. SPACE PLANNING AND INTERFACE 44 source for the same function may use the AB outline. 8 mm lead spacing. These devices usually require special handling fixtures for efficient assembly processes. Ceramic ICs Due to the various size differences of IC packages offered by the IC manu­ facturers a multiple source may not be possible for applications requiring a ce­ ramic body. In the case of leaded ceramic flat packs, there are some similari­ ties. 050 inch with a lead length that is generally excessive and extends far beyond the substrate surface.

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